深圳市千纳成材料科技有限公司，精密材料（BGA锡球、激光锡球焊用锡球）国内领先制造商，致力于为半导体封装领域以及精密电子激光锡球焊接等自动化制造提供优质材料。
工厂坐落于深圳市坪山新区，是一家专业研发、生产和销售高精密度材料的高科技企业。企业拥有完全自主知识产权，涵盖从制造设备的研发、生产工艺及流程设计、生产线设计组装、抗氧化工艺及技术等。采用国际先进的检测设备，拥有持续稳定量产能力。目前主要产品有芯片BGA、CSP等封装用锡球，以及激光焊接用高精度锡球，锡球产品球径覆盖0.10mm至2.00mm区间范围，终端应用产品包括CPU、GPU、DDR等芯片以及各类自动化锡球焊电子产品。
公司对产品进行严格品质管控，球径、真圆度、含氧量、CPK值、DSC等核心技术参数均按严格标准进行。产品均通过回流焊、高温高湿、自动植球等实验测试合格。
另外我们积极响应履行国家对企业，社会环境的义务和责任，在我们所有产品业务中致力于环保和可持续发展。
公司锡球产品国内领先，拥有高性价比，比肩日美一流国际品牌，产品畅销国内外，我们将继续努力为客户提供更加优质的产品和服务。


Shenzhen Qianasn Material Technology Co., Ltd, a manufacturer of precision materials, is committed to providing high-quality materials for IC Packages.
We have independent intellectual property rights, covering R & D of manufacturing equipment, production process and procedure design, production line design and assembly, anti-oxidation technics and technology, etc.
At present, our main product is solder ball for BGA, CSP and other packages. The ball diameter of the products covers the range from 0.10mm to 0.76mm. Lead-Free Solder Ball meets the RoHS, REACH, EU hazardous materials requirements. The terminal application products include CPU, GPU, DDR and other chips.
In addition, we actively respond to the implementation of state obligations and responsibilities to the corporate, social and environmental, in all of our products and businesses committed to environmental protection and sustainable development.
The products sell well at home and abroad, We are committed to enhancing close partnerships with our clients to provide more competitive products and services.